LET-1064nm-300mW-COS

1. COS, short for Chip on Submount, is a mature high-power laser diode packaging solution.

2. The laser chip is directly bonded onto a thermal submount, delivering excellent heat dissipation, low thermal resistance and outstanding mechanical stability.

3. Compared with traditional TO packaging, COS laser chips support higher power density and simpler optical integration.

4. They are widely adopted as core laser sources for fiber laser pumping, industrial material processing, medical equipment, optical sensing and laboratory research.

5. Our COS laser chips go through full optical and electrical testing before shipment.

6. We provide optional wavelength, power and emitter size, supporting sample order and OEM customization.

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Detail

COS (Chip on Submount) packaging is designed to solve the heat bottleneck of high-power semiconductor laser chips. Instead of packaging the chip inside a metal can, the laser die is mounted directly on an AlN or DBC thermal submount with AuSn eutectic bonding. This structure shortens the heat conduction path, greatly reduces thermal resistance and avoids thermal crosstalk under continuous high-current operation. It is one of the mainstream light source components for modern high-brightness laser systems.

Our COS laser chips maintain stable optical power output with small wavelength drift during long-hour continuous working. The gold wire bonding process ensures reliable electrical connection and shock resistance, suitable for integration into compact fiber-coupled modules, collimated laser assemblies and multi-emitter laser arrays. For system developers, COS chips reserve flexible optical adjustment space, easy to match fast-axis collimation FAC lens and slow-axis SAC lens for beam shaping.

Core Features

Low thermal resistance, superior heat dissipation, support CW continuous operation
High electro-optic conversion efficiency, low wavelength temperature drift
AuSn eutectic bonding, good mechanical stability, anti-vibration
Compact Chip on Submount form, easy for secondary optical integration
Multiple wavelength & power options, single emitter / multi-emitter available
100% tested before delivery, RoHS compliant, sample available

Parameter	Specification
Product Name	COS Laser Chip
Optional Wavelength	785nm / 793nm / 808nm / 930nm / 850nm / 880nm / 905nm / 915nm / 940nm / 976nm / 980nm 1064nm / 1210nm / 1260nm / 1310nm / 1470nm / 1550nm / 1710nm / 1940nm
Output Power	300mW–125W (customizable)
Operation Mode	CW Continuous Wave / Pulsed optional
Bonding Process	AuSn eutectic bonding

Application

Fiber laser & solid-state laser pumping source
Industrial laser material processing
Medical aesthetic laser equipment
Optical sensing, ranging and spectroscopic instruments
Laboratory research and optical system development

We support customized emitter width, wavelength tolerance and beam angle according to your optical design. All products come with test report, fast delivery and technical support for module integration.

FAQ

Q: What does COS mean for laser diodes?A: COS stands for Chip on Submount. It means the laser chip is mounted directly on a thermal conductive submount instead of sealed TO can packaging, mainly for high power laser applications.

Q: What is the advantage of COS chip over TO laser diode?A: COS has much lower thermal resistance, higher power density, better heat dissipation and is easier for beam shaping and fiber coupling. TO packages are more suitable for low-power small laser products.

Q: Can I get COS laser chip samples?A: Yes, we provide sample service for performance verification. Bulk order and OEM customization are also available.

Q: Does the COS chip include collimation lens?A: Standard COS chip is bare chip on submount without lens. FAC or SAC lenses can be matched separately for beam collimation.